AIM SN100C Lead-Free Solid Solder Wire, 0.125″ dia., 1 lb. Spool

Wave/Selective Soldering

The main differences between wave soldering with Sn63/Pb37 tin-lead solder and SN100C® are:

The “process window”; the difference between the process temperature and the melting point of the solder is smaller.

At the recommended process temperatures the wetting of SN100C® is slower. Higher solder temperature can speed wetting. Higher temperature operation will not affect the SN100C alloy; however, thermal damage, increased copper dissolution and dross generation are possible and need to be considered.

Operators need to ensure that the wave soldering machine is designed to keep board and solder temperatures within these ranges throughout the process.

Product Overview