CircuitMedic 115-3302 Circuit Bond Epoxy Pack

Circuit Bond Application Instructions

Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.

To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.

Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed.

NOTE: Circuit Bond may contain bubbles from the mixing process. If needed use a vacuum system to remove bubbles.

If desired Color Agent can be mixed in with Circuit Bond to match surface colors.

Apply using a Foam Swab, Micro Probe or Mixing Stick as required.

Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).

Product Overview