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Original price was: $76.17.$22.85Current price is: $22.85.
ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. ALPHA HiTech CU11-3127 provides full bottom component coverage at room temperature.
A higher preheat temperature up < 80° C may be applied to the substrate for a faster underfill flow rate.
Product Overview
| SKU | I345185 |
|---|---|
| Part No. | 259033.0070GME |
| Brand | ALPHA HiTech |
| Type | Underfill |
| Size | 50cc |
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