ALPHA HiTech CF12-4485B is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required. Provides excellent adhesion strength, excellent thermal cycling performance, and multiple curing options. Well suited for consumer electronics assemblies. Product is Halogen Free.
Product Overview
More Information
SKU
G100648
Part No.
CF12-4485B
Brand
ALPHA HiTech
Type
Edgebond
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