Kester CU31-2030 Reworkable Underfill Epoxy

ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties. In addition, it has a high Tg and low modulus which results in excellent reliability performance. ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices. All ALPHA HiTech products are Halogen Free.

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