Kester SAC305 Sn96.5/Ag3.0/Cu0.5 Lead-Free, Halogen-Free No-Clean Solder Paste

Along with the ability to achieve CpK values>2.0 with transfer efficiencies between 60% – 120% at area ratios. Additionally, this material provides outstanding electrochemical performance, even under very harsh environmental conditions along with being pin-testable and is IPC J-STD-004B as ROL0. NP575-KAP is Kester’s leading no-clean paste and part of our high-performance portfolio of products.

Features

Zero-halogen (none intentionally added)

Wide process window and consistent print performance to 0.6AR

Excellent reflow and coalescence using both ramp and soak profiles

Excellent pin testability

Excellent electrochemical reliability

RoHS Compliant

Product Overview