Kester Sn62/Pb36/Ag2 No-Clean Solder Paste

EP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.

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