Laird Tflex™ 300 Series Silicone Based Thermal Gap Filler

Capabilities

Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing

Industries

Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom

Applications

Automotive ADAS | Automotive Electronics | Automotive Infotainment | Automotive Powertrain/ECUs | Drones/Satellites | Gaming Systems | Instrumentation | Notebooks/Tablets/Portable Devices | Routers | Smart Home Devices | Wireless infrastructure

Specifications

Construction & Composition: Ceramic filled silicone sheet

Color: Light Green

Thermal Conductivity (W/mK): 1.2

Density (g/cc): 1.78

Hardness (Shore 00): 51.4 (20-30 mil), 25.2 (40+ mil)

Outgassing TML (weight %): 0.56

Outgassing CVCM (weight %): 0.1

Temperature Range: -40-160°C

Rth@ 40 mils, 10 psi, 50°C: 0.98°C-in2/W

Dielectric Constant @ 10GHz: 4.5

UL Flammability Rating: V-0

Volume Resistivity: 10¹³ Ohm-cm

Product Overview

More Information

SKU	G100985
Brand	Laird