Laird Tflex™ HD700 Series Silicone Based Thermal Gap Filler

Capabilities

Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing

Industries

Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom

Applications

Automotive ADAS | Automotive Electronics | Automotive Infotainment | Automotive Powertrain/ECUs | Drones/Satellites | Gaming Systems | Instrumentation | Notebooks/Tablets/Portable Devices | Routers | Smart Home Devices | Wireless infrastructure

Specifications

Construction & Composition: Ceramic filled silicone sheet

Color: Pink

Thermal Conductivity (W/mK): 5.0

Density (g/cc): 3.3

Hardness (Shore 00): 54

Outgassing TML (weight %): 0.23

Outgassing CVCM (weight %): 0.07

Temperature Range: -50-200°C

Rth@ 40 mils, 10 psi: 0.287°C-in2/W

Dielectric Constant @ 1 MHz: 5.01

UL Flammability Rating: V-0

Volume Resistivity: 1.4 x 10¹⁴ Ohm-cm

Product Overview

More Information

SKU	G100987
Brand	Laird