Laird Tflex™ SF10 Series Thermal Gap Filler

Capabilities

Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing

Industries

Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom

Applications

Automotive Electronics | Automotive ADAS | Automotive Powertrain/ECUs |Automotive Infotainment | Routers | Hard Disk Drives | Solid State Drives | Wireless infrastructure | Drones/Satellites | Gaming Systems | Smart Home Devices | Notebooks/Tablets/Portable Devices

Specifications

Construction & Composition: Ceramic filled silicone free thermoplastic

Color: Grey

Thermal Conductivity (W/mK): 10

Density (g/cc): 3.7

Hardness Shore 00 (3 second): 41 (1mm-4mm), 70 (0.5mm-0.75mm)

Outgassing TML (weight %): 0.33

Outgassing CVCM (weight %): 0.15

Temperature Range: -40-125°C

Thermal Resistance (1.5mm) @ 30% deflection, 50°C: 1.312°C-cm2/W (0.203 Cin2/W)

Dielectric Constant @ 1 MHz: 9

UL Flammability Rating: V-0

Volume Resistivity: 10¹⁴ Ohm-cm

Product Overview

More Information

SKU	G100989
Brand	Laird