Laird Tpcm™ 780SP Screen Printable Phase Change Material

Industries

Consumer | Telecom/Datacom

Applications

Graphic Cards | Hard Disk Drives | IGBTs | Memory Modules | Notebooks/Tablets/Portable Devices | Servers | Smart Home Devices | Wireless infrastructure

Capabilities

Automated Packaging | Autoated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing

Specifications

Construction: Filled Non-Silicone Paste

Color: Gray

*Density: 2.5 g/cc

*Bulk Thermal Conductivity (W/m-K): 5.4

Thermal Resistance (°C-cm²/W @70°C):

10 psi: 0.120

50 psi: 0.085

Viscosity:

35 Pa-s @25°C

50,000 – 100,000cPs @25°C

*Operating Temperature Range: -40°C – 125°C

*Softening Temperature Range: ~45°C – 70°C

*Minimum Bondline Thickness: 25µm

*Dielectric Constant: 22.3@1KHz, 22.9@1MHz

*Volume Resistivity: 1.5 x 10¹³Ω-cm

*UL Recognition: V-0

*De-notes after solvent evaporation. Solvent evaporates within two hours at 60°C, or 8 hours at room temperature. After solvent evaporation the Tpcm™ 780SP will be firm and dry to the touch.

Product Overview

More Information

SKU	G101074
Brand	Laird