Laird Tpcm™ 900 Thermal Phase Change Material

Industries

Consumer | Telecom/Datacom

Applications

Graphic Cards | Hard Disk Drives | IGBTs | Memory Modules | Notebooks/Tablets/Portable Devices | Servers | Smart Home Devices | Wireless infrastructure

Capabilities

Automated Packaging | Autoated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing

Specifications

Construction: Non-reinforced boron nitride filled film

Color: Yellow

Thickness:

905C: 0.005″ (0.13mm)

910: 0.010″ (0.25mm)

920: 0.020″ (0.51mm)

Thickness Tolerance:

905C/910: ± 0.001″ (± 0.025 mm)

920: ± 0.002″ (± 0.05 mm)

Density:

905C: 1.31 g/cc

910/920: 1.39 g/cc

Temperature Range: -25 to 125°C

Phase Change Softening Temperature: 50°C – 70°C

“Burn In” Temperature: 70°C for 5 minutes

Thermal Conductivity (W/mK):

905C: 0.7

910/920: 2.23

Volume Resistivity: 2 x 10¹³ ohm-cm

Dielectric Constant @1 MHz: 3.1

Thermal Impedance

	Tpcm™ 905C	Tpcm™ 910	Tpcm™ 920
@ 10 psi (69 KPa)	0.048°C-in2/W (0.31°C-cm2/W)	0.14°C-in2/W (0.90 °C-cm2/W)	0.18°C-in2/W (1.14°C-cm2/W)
@ 50 psi (345 KPa)	0.029°C-in2/W (0.19°C-cm2/W)	0.083°C-in2/W (0.53°C-cm2/W)	0.095°C-in2/W (0.61°C-cm2/W)

Standard Thicknesses: 0.005″ (0.13 mm), 0.010″ (0.25 mm) and 0.020″ (0.51 mm). Consult the factory for alternate thicknesses.

Standard Sheet Sizes: 9″ x 9″ (229 mm x 229 mm) Tpcm™ 900 sheets are supplied with a white release paper and a bottom liner.

Pressure Sensitive Adhesive: Pressure sensitive adhesive is not applicable for Tpcm™ products.

Reinforcement: No reinforcement is necessary.

Product Overview

More Information

SKU	G101075
Brand	Laird