Permabond 170 Metal Bonding Max. Gap Fill Cyanoacrylate Adhesive, Clear, 16 oz. Bottle

Original price was: $282.40.Current price is: $70.59.

SKU: SK0133059-US20260630-101428 Category: Tag:

Physical Properties of Uncured Adhesive

    Chemical composition: Methyl cyanoacrylate

    Appearance: Colourless to slightly cloudy

    Viscosity @ 25°C: 1,500 mPa.s (cP)

    Specific gravity: 1.1

Typical Curing Properties

    Maximum gap fill: 0.38mm (0.015″)

    Fixture/handling time* (0.3 N/mm2 shear strength is achieved):

      15 seconds (Steel)

      15 seconds (Buna N Rubber)

      15 seconds (Phenolic)

    Full strength: 24 hours

*Handling times can be affected by temperature, humidity and specific surfaces being bonded. Larger gaps or acidic surfaces will also reduce cure speed but this can be overcome by the use of Permabond C Surface Activator (CSA) or Permabond QFS 16.

Typical Performance of Cured Adhesive

    Shear strength* (ISO4587):

      Steel 23-25 N/mm2 (3300-3600 psi)

      Aluminium 13-15 N/mm2 (1900-2200 psi)

      Brass 20-22 N/mm2 (2900-3200 psi)

      Stainless st. 20-22 N/mm2 (2900-3200 psi)

      ABS>9 N/mm2 (>1300) SF**

      Acrylic 13-15 N/mm2 (1900-2200psi)

      Nitrile rubber>4 N/mm2 (>550 psi) SF**

      Butyl rubber>2 N/mm2 (>300 psi) SF**

      Phenolic>10N/mm2 (>1400 psi) SF**

    Impact strength (ASTM D-950): 3-5 kJ/m2 (1.4-2.4 ft-lb/in2)

    Dielectric constant @10kHz: 2.5

    Dielectric strength: 25 kV/mm

    Coefficient of thermal expansion: 90 x 10-6mm/mm/°C

    Coefficient of thermal conductivity: 0.1 W/(m.K)

    Hardness (ISO868): 85 Shore D

*Strength results will vary depending on the level of surface preparation and gap.
**SF = Substrate failure

Product Overview

More Information
SKU I167184
Part No. CA001700016Z0101
Brand Permabond
Type Cyanoacrylate
Volume 1 lb. (16 oz.)

Reviews

There are no reviews yet.

Be the first to review “Permabond 170 Metal Bonding Max. Gap Fill Cyanoacrylate Adhesive, Clear, 16 oz. Bottle”

Your email address will not be published. Required fields are marked *